Siemens EDA is a global technology leader in Electronic Design Automation products and systems. Our portfolio enables companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Siemens EDA is seeking a senior level, self-starting, motivated, and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs.
Responsibilities
- Drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs
- Develop package floor planning, package/chiplet level functional/IO planning, interposer/substrate planning, layout, package level connectivity, Logical Equivalence Checking (LEC), package level 3D stack (DRC/LVS) verification and physical DRC/DFM verification of the package components
- Integrate the other 3D IC workflows into the 3D IC Physical Design workflow
- Provide technical support and guidance to the sales, marketing design service organizations
Requirements
- BS or MS in Electrical/Computer Engineering or equivalent
- Advanced package physical design and verification experience
- Working knowledge of Advanced Packaging IC EDA tools and design methods
- Detailed knowledge of EDA data formats
- Proficient in scripting/programming: Python, Tcl, Perl, or similar
- Working knowledge of IC EDA tools and design methods
- Working knowledge of Thermal/Stress analysis and/or optical design tools and design methods
- Working competency with Microsoft Office suite
Benefits
- Flexible work options (remote/hybrid)
- Competitive compensation and benefits package
- Opportunities for professional growth and development
- Collaborative and supportive work environment